Exaddon’s process delivers probes of customizable design, 3D printed directly on microPCBs. This multi-layer microPCB acts as the interposer, probe head, and fan-out. It is compatible with current probe stations.
With 128 probes, our microL64 gives microLED testers a 64x increase in test efficiency. A wafer that would otherwise require 2 months for 100% testing can now be inspected in less than a day.
The layout of Exaddon’s microL64 probe head is customizable, and with a pitch of less than 20 μm, we are breaking the current industry limit and setting the start point for a new era in enabling scaling down the size of microLED testing.
The exceptional planarity (±2 µm) allows for low overdrive, decreasing the testing time.
MicroLED testing with Exaddon's 3D printed probes has received excellent industry reception in Taiwan, Japan and the USA.
Beyond microLEDs, any applications which need fine-pitch probing stand to benefit from this approach, including parametric test, microbump contacting, RF applications, and more.